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High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

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High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

Brand Name : TECircuit

Model Number : TEC0168

Certification : UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W

Place of Origin : China

MOQ : 1pcs

Price : USD 1.99 ~ USD9.99/pcs

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 50000 pcs/month

Delivery Time : 5-15 wotk days

Packaging Details : Vacuum package+Carton box

Brand : Shenzhen Tecircuit Electronics Co., Ltd

Product Type : PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core

Item No. : RF0011

Service : PCBA service

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Product Images

High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

  • Display Connections:

    • Used to connect screens (LCD, OLED) to the motherboard, facilitating flexible routing in compact spaces.

  • Camera Modules:

    • Employed to connect front and rear cameras to the main circuit board, allowing for high-resolution image capture.

  • Battery Connections:

    • Integrated into circuits that connect batteries to power management systems, enabling efficient power distribution.

  • Touchscreen Interfaces:

    • Used in touchscreen assembly to connect touch sensors, ensuring responsive interaction with the device.

  • Audio Components:

    • Employed to connect microphones, speakers, and audio chips, supporting high-quality sound output and input.

  • Wireless Communication Modules:

    • Integrated into modules for Wi-Fi, Bluetooth, and cellular communication, ensuring reliable connectivity.

  • Sensors:

    • Used to connect various sensors (accelerometers, gyroscopes, proximity sensors) that enhance smartphone functionality.

  • LED Notifications:

    • Employed in circuits for notification lights or indicators to provide visual alerts for incoming messages or calls.

  • Charging Ports:

    • Integrated into charging circuits, facilitating connections for USB or wireless charging systems.

  • Vibration Motors:

    • Used to connect haptic feedback motors, enhancing user experience through tactile notifications.

Product Features

  1. Flexibility:

    • FPCs can bend and conform to the intricate shapes of smartphone designs, optimizing space utilization.

  2. Lightweight:

    • The lightweight nature of FPCs contributes to the overall reduction in device weight, enhancing portability.

  3. Thin Profile:

    • FPCs are thinner than traditional rigid PCBs, allowing for sleeker device designs without compromising functionality.

  4. High Thermal Resistance:

    • Designed to withstand heat generated by components, ensuring reliable performance during prolonged use.

  5. Excellent Electrical Performance:

    • Provides low resistance and high signal integrity, essential for the fast data transmission required in smartphones.

  6. Durability:

    • Built to endure mechanical stress and vibrations, ensuring long-term reliability in everyday use.

  7. Customization:

    • Can be tailored to fit specific smartphone designs and configurations, allowing for unique layouts.

  8. Ease of Assembly:

    • Simplifies the manufacturing process, making it easier to integrate into compact smartphone designs.

  9. Water and Dust Resistance:

    • Often treated with protective coatings to withstand environmental factors, enhancing durability.

  10. Compliance with Industry Standards:

    • Manufactured to meet industry safety and performance standards, ensuring reliable operation in consumer electronics.

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers: 1-42layers
PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size: 620mm*1100mm
PCB certificate: RoHS Directive-Compliant
PCB Thickness: 1.6 ±0.1mm
Out Layer Copper Thickness: 0.5-5oz
Inner Layer Copper Thickness: 0.5-4oz
PCB max. board thickness: 6.0mm
Minimum Hole Size: 0.20mm
Minimum Line Width/Space: 3/3mil
Min. S/M Pitch: 0.1mm(4mil)
Plate Thickness and Aperture Ratio : 30:1
Minimum Hole Copper: 20µm
Hole Dia. Tolerance(PTH): ±0.075mm(3mil)
Hole dia. Tolerance(NPTH): ±0.05mm (2mil)
Hole Position Deviation: ±0.05mm (2mil)
Outline Tolerance: ±0.05mm (2mil)
PCB solder mask: Black, white, yellow
PCB surface finished: HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend: White
E-test: 100% AOI, X-ray, Flying probe test.
Outline: Rout and Score/V-cut
Inspection Standard: IPC-A-610CCLASSII
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports: Final Inspection, E-test, Solderability Test, Micro Section and More

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